{"created":"2023-05-15T12:25:48.960399+00:00","id":1129,"links":{},"metadata":{"_buckets":{"deposit":"3ac18ed1-f54b-4f7b-a259-e56d939d12b2"},"_deposit":{"created_by":4,"id":"1129","owners":[4],"pid":{"revision_id":0,"type":"depid","value":"1129"},"status":"published"},"_oai":{"id":"oai:kait.repo.nii.ac.jp:00001129","sets":["2:16:42:129"]},"author_link":[],"item_10002_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2015-03-20","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"56","bibliographicPageStart":"51","bibliographicVolumeNumber":"39","bibliographic_titles":[{"bibliographic_title":"神奈川工科大学研究報告.B,理工学編"}]}]},"item_10002_description_19":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_10002_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Recently, the increasing performance of semiconductor devices has been accompanied by a simultaneous rise in the amount of heat they emit. When an electronic device is mounted on a metallic heat sink, a thermal interface material is required to handle the thermal energy emitted while simultaneously maintaining an acceptable level of electrical insulation. However, the thermal characteristics of thermal interface materials are strongly influenced by the manner in which they make contact with the heat sink. We proposed measuring the thermal characteristics of a thermal interface material placed on an aluminum plate that had been machine-milled to form precise grooves designed to simulate heat sink surface roughness, and called it a “non-flat plate\". This plate had nine 1-mm-wide 0.3-mm-deep grooves situated 4 mm apart. When pressure is applied to the thermal interface material, the material penetrates into these grooves, thus increasing contact between the two materials and consequently decreasing thermal resistance. Then, by varying the groove shapes and applied pressure amounts, contact conditions can be precisely controlled. This allows complex thermal parameters to be measured with good repeatability.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_10002_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.34411/00001122","subitem_identifier_reg_type":"JaLC"}]},"item_10002_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"神奈川工科大学"}]},"item_10002_source_id_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA12669200","subitem_source_identifier_type":"NCID"}]},"item_10002_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"21882878","subitem_source_identifier_type":"PISSN"}]},"item_10002_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"斎藤, 靖弘","creatorNameLang":"ja"}]},{"creatorNames":[{"creatorName":"鈴木, 悟","creatorNameLang":"ja"}]},{"creatorNames":[{"creatorName":"小室, 貴紀","creatorNameLang":"ja"}]},{"creatorNames":[{"creatorName":"Saito, Yasuhiro","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Suzuki, Satoru","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Komuro, Takanori","creatorNameLang":"en"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2015-04-30"}],"displaytype":"detail","filename":"kkb-039-010.pdf","filesize":[{"value":"4.0 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"kkb-039-010.pdf","objectType":"fulltext","url":"https://kait.repo.nii.ac.jp/record/1129/files/kkb-039-010.pdf"},"version_id":"fef29204-bbee-4593-a6e8-4f648ab3c593"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Thermal Interface Material","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Thermal Contact Resistance","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"AskerC Hardness","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"TIM の密着具合に関する研究","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"TIM の密着具合に関する研究","subitem_title_language":"ja"},{"subitem_title":"A Study on Contact Condition of Thermal Interface Material.","subitem_title_language":"en"}]},"item_type_id":"10002","owner":"4","path":["129"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2020-11-24"},"publish_date":"2020-11-24","publish_status":"0","recid":"1129","relation_version_is_last":true,"title":["TIM の密着具合に関する研究"],"weko_creator_id":"4","weko_shared_id":-1},"updated":"2023-08-04T09:26:25.525135+00:00"}